| 摘要 |
A module, which in one embodiment may be a packaged millimeter waver module, includes a semiconductor lid portion; a packaging portion attached to the lid portion, wherein the packaging portion comprises a plurality of vias, a carrier portion, wherein a first semiconductor die is attached to the carrier portion, the packaging portion is attached to the carrier portion so that the packaging portion is over the carrier portion and the semiconductor die is within an opening in the packaging portion, and the lid portion and the carrier portion form an first air gap around the first semiconductor device. |
