| 摘要 |
<p>A wiring board (10) comprises an insulating substrate (11), wiring substrates (12-14), and insulating layers (411, 413) each having a via hole (431, 433) which is provided with a conductor (441, 443) by plating. The insulating substrate (11) and the wiring substrates (12-14) are arranged horizontally. The insulating layers (411, 413) are so arranged as to cover a first boundary portion (R2c) between the insulating substrate (11) and the wiring substrates (12-14), and second boundary portions (R3a, R3b) between the wiring substrates (12-14), and the insulating layers continuously extend from the insulating substrate (11) to the wiring substrates (12-14). The first boundary portion (R2c) and the second boundary portions (R3a, R3b) are respectively filled with resins (11a-11c), which constitute the insulating layers (411, 413). The conductors (441, 443) and wiring layers (212a, 212b, 324, 325, 124, 125) are electrically connected with each other.</p> |
