| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability by dispersing a thermal stress between components in a semiconductor device packaged with a molding resin, and suppressing the warpage of semiconductor chips so as to increase the flatness of the chips. <P>SOLUTION: The semiconductor device has a plurality of semiconductor chips 3A and 3B; a die pad 2 on which the plurality of semiconductor chips are held; lead frames 1 acting as the electrodes of the plurality of semiconductor chips; and a molding resin material 7 for molding the plurality of semiconductor chips, the die pad, and the inner portions of the lead frames. The die pad has an upset portion 2a that is smaller than the area of the first semiconductor chip 3A held on the die pad and protrudes upward as a flat portion. The upset portion and the first semiconductor chip are bonded to each other with an adhesive paste 4. A portion other than the upset portion on the die pad is covered with a buffer resin material 8 that is less elastic than the molding resin material. <P>COPYRIGHT: (C)2010,JPO&INPIT |
