THERMOSETTING RESIN COMPOSITION, ITS CURED PRODUCT, OPTICAL MEMBER, OPTICAL SEMICONDUCTOR, AND METHOD FOR MANUFACTURING THEM

摘要

PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition capable of obtaining a cured product being excellent in light-resistance and being suitable for an optical member; a cured product and an optical member being excellent in light-resistance; and an optical semiconductor hardly reducing a light taking out efficiency.

SOLUTION: The thermosetting resin composition is used, which contains 0.5-10 pts.mass of a thermal polymerization initiator (D) having a 10-hour half-life temperature of 110°C or less and being liquid at 25°C based on 100 pts.mass of a resin component containing: 20-50 mass% of a methacrylic polymer (A); 45-75 mass% of cyclohexyl methacrylate (B); and 5-15 mass% of a (meth)acrylic radical polymerizable monomer (C) having two or more double bonds in one molecule.

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