| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed-circuit board with a built-in chip, and a method for manufacturing the board. <P>SOLUTION: There is disclosed the printed-circuit board with the built-in chip including: an insulating layer 13 on which a via 15a is penetrated; a first chip 12 and a second chip 22 integrated in the insulating layer 13 formed with pads 12a and 22a on one faces, respectively, and exposed on the upper face and lower face of the insulating layer 13; an upper pattern 15b formed on the upper face of the insulating layer 13 so as to be connected to the pad 12a of the first chip 12 and the via 15a; and a lower pattern 15c formed on the lower face of the insulating layer 13 so as to be connected to the pad 22a of the second chip 22 and the via 15a. Also, there is disclosed a method for manufacturing the printed-circuit board with a built-in chip. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
