发明名称 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of preventing the re-adhesion of contaminant and the like and improving a cleaning treatment effect. SOLUTION: The treatment apparatus includes a treatment tank where each substrate to be treated is erected and stored in a clearance between a pair of confronted first and second erection walls erected by leaving a prescribed interval, a treatment liquid is supplied and the surface treatment of the substrate to be treated is performed. In the first and second erection walls 2b and 3, a first fluid control means is arranged on an inner wall face of either confronted wall. The first fluid control means is formed of dimples a<SB>1</SB>to a<SB>n</SB>changing a flow of the treatment liquid between an inner wall face side where the fluid control means is arranged and a substrate face side of the substrate W to be treated. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010135421(A) 申请公布日期 2010.06.17
申请号 JP20080307837 申请日期 2008.12.02
申请人 SES CO LTD 发明人 NAKAMU KATSUYOSHI;ISHIKAWA CHII;KANETAKA HIROAKI;WATASE MASAYUKI;SATO REIGO
分类号 H01L21/304;G02F1/13;G02F1/1333 主分类号 H01L21/304
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