| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board analysis device, wherein accuracy is secured and the processing time for thermal analysis is reduced by simplifying a built-in electronic component of printed board model data. SOLUTION: This printed board analysis device includes: an acquisition part 1, acquiring the printed board model data of a printed board mounted with electronic components in internal wiring layers, having an insulation layer between the wiring layers; an electronic component extraction part 2, extracting from the printed board model data, the electronic component mounted in the internal wiring layer, having an attribute of heat generation from the electronic components; a physical property data conversion part 3 rewriting the physical property data of the wiring layer contacting with a mounting face mounted with the extracted electronic component to a value, based on physical property data of the electronic component, and converting physical property data of a portion disposed with the electronic component extracted by the extraction part into physical property data of the insulation layer; and an analysis part 4, performing heat analysis processing by use of the converted printed board model data. COPYRIGHT: (C)2010,JPO&INPIT |
