| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for dividing an AlTiC substrate which can improve productivity by cutting down a cut plane polishing process. SOLUTION: The method for dividing the AlTiC substrate having lines along which the substrate is to be divided includes a machined groove forming process for forming a laser-machined groove by radiating laser beams along the lines and a cleavage process for cleaving the substrate along the laser-machined groove. The laser beams is made incident from the back of the AlTiC substrate, and the laser-machined groove is formed to be open in the back of the AlTiC substrate. COPYRIGHT: (C)2010,JPO&INPIT
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