| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the method of connection and fixing of a micro-electronic device having a size of about 100 μm. <P>SOLUTION: The connection of electronic devices 100 with a metal electrode 103 is made by disposing the electronic devices 100 on the hydrophilic metal electrode 103 formed on a substrate 101, applying a second liquid 113 such as glycerin on the hydrophilic metal electrode 103 surrounded by a hydrophobic region 102 and electronic devices 100, and then heating the substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT |
