| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a joined body forming method for firmly and efficiently joining two base materials with each other with high dimensional accuracy and under low temperature, and efficiently separating the base materials from each other after the use, and to provide a reliable joined body formed by firmly joining two base materials with each other with high dimensional accuracy. Ž<P>SOLUTION: The joined body forming method comprises: a step of depositing joining films 31, 32 consisting of copper and organic components with the copper content being ≥90 at.% and <99 at.% on a first substrate (base material) 21 and a second substrate (base material) 22 by using a chemical vapor deposition method; and a step of obtaining a joined body by bonding the joining films 31, 32 with each other by applying the compressive force between the first substrate 21 and the second substrate 22 while the first substrate 21 and the second substrate 22 are brought into contact with each other so that the joining films 31, 32 are opposite to each other. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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