| 发明名称 |
Three-dimensional Wiping Substrate And Method Therefor |
| 摘要 |
A planar substrate has a moisture activated shrinking filament applied thereon. When wetted, the shrinking filament shrinks and causes the planar substrate to gather and pucker. The planar substrate with the filament thereon may be compressed into a compact shape when in a dry state.
|
| 申请公布号 |
US2010147203(A1) |
申请公布日期 |
2010.06.17 |
| 申请号 |
US20080336078 |
申请日期 |
2008.12.16 |
| 申请人 |
MACDONALD JOHN GAVIN;KIM JAEHO;LEE WANDUK;HEO JIN;KOH CHOLWON;LEE SANGSOO |
发明人 |
MACDONALD JOHN GAVIN;KIM JAEHO;LEE WANDUK;HEO JIN;KOH CHOLWON;LEE SANGSOO |
| 分类号 |
D05B3/00 |
主分类号 |
D05B3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
