| 摘要 |
An electronic component apparatus includes a wiring board 10, an electronic component 20 disposed thereon, a frame-like member 30 provided on the wiring board 10 to surround the electronic component 20 and to have a ring-like bonding portion 34, and a cap member 50 which is bonded to the ring-like bonding portion 34 of the frame-like member 30 to constitute a housing portion H for housing the electronic component 20 together with the wiring board 10 and the frame-like member 30. In an upper part of one region of the ring-like bonding portion 34, a groove 36 for air contained in the housing portion H is provided to extend from an inner peripheral surface of the ring-like bonding portion 34 to an outer side of the cap member 50.
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