| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of removing wax for uniformly removing the wax adhered to the wafer surface and for reducing the occurrence of re-adhesion of particles during the cleaning and clogging of filter provided in the cleaning tank. SOLUTION: In the method of cleaning semiconductor wafer to remove the wax adhered to the wafer surface using a cleaning liquid, the cleaning liquid includes micro-bubbles. COPYRIGHT: (C)2010,JPO&INPIT |
