| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a paste-like joining agent for a metal component to be a porous sintered compact for adhering to the contacted metal component in which metal particles are sintered when heated, and a method of manufacturing a bump for electric circuit connection excellent in adhesiveness to a substrate electrode, heat-resistant processability, and electrical conductivity. <P>SOLUTION: A paste-like material includes (A) metal particles having an average particle diameter (median size D50) of 0.1-50μm and melting point of≥400°C, and being heat sinterable, and (B) liquid flux, and forms the joining agent for the metal component which becomes the porous sintered compact having adhesiveness to the contacted metal component in which the metal particles (A) are sintered, when heated at 70-400°C. The method of producing the metal component joined article is constituted by heating the joining agent stood between the metal components at 70-400°C. The metal component joined article is constituted in which a plurality of metal components are joined by the porous sintered compact having porosity of 5-50 area%, melting point of >400°C, and volume resistivity of≤1×10<SP>-2</SP>Ωcm. The method of manufacturing the bump for electric circuit connection is constituted by heating the joining agent. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
