| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition with excellent thermal conductivity, a semiconductor sealing material, prepreg and a cured product. SOLUTION: The epoxy resin composition contains an epoxy resin obtained by reacting dihydroxy naphthalenes with an epihalohydrin, a curing agent, and an inorganic filler with thermal conductivity of 20 W/m×K or more. COPYRIGHT: (C)2010,JPO&INPIT
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