发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To suppress damage to a gate insulating film during a step of removing a gate electrode in a semiconductor device having a dual metal gate structure. SOLUTION: In a semiconductor device having a first transistor and a second transistor, the first transistor includes: a first gate electrode including a first material having a first work function; and a first gate insulating film. The second transistor includes: a second gate electrode including a second material having a second work function; and a second gate insulating film. The first gate insulating film includes high dielectric constant films and a first insulating film formed on a first high dielectric constant film. In the second gate insulating film, after removing the first gate electrode, the first insulating film formed on the upper part of the high dielectric constant films is removed. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010135823(A) 申请公布日期 2010.06.17
申请号 JP20100020027 申请日期 2010.02.01
申请人 RENESAS TECHNOLOGY CORP 发明人 OTSUKA FUMIO
分类号 H01L29/78;H01L21/336;H01L21/8234;H01L21/8238;H01L27/088;H01L27/092;H01L29/423;H01L29/49 主分类号 H01L29/78
代理机构 代理人
主权项
地址
您可能感兴趣的专利