| 摘要 |
PROBLEM TO BE SOLVED: To provide a load port which can deliver a wafer between the inside of an FOUP and a semiconductor manufacturing device even during a purge operation. SOLUTION: The load port 1 formed at a common clean room to adjoin a semiconductor manufacturing device includes a purge stage 2 having a purge port (injection purge port 23 and discharge purge port 24) for replacing a gas atmosphere in the FOUP with nitrogen gas, an opener stage 3 which is provided in parallel with the purge stage 2 and has an opening 33 communicating with the inside of the semiconductor manufacturing device B and a door 34 for opening and closing the opening 33, and a moving mechanism 4 for moving the FOUP between the purge stage 2 and the opener stage 3. COPYRIGHT: (C)2010,JPO&INPIT |
