| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet without intrusion of a sealing material into the interface of the adhesive sheet and a material to be adhered even when sealing a semiconductor element under high pressure, capable of eliminating a space without filling in pressure bonding and excellent in heat resistance and moisture resistance, and to provide the semiconductor element using the same. Ž<P>SOLUTION: The adhesive sheet includes a resin composition without foaming at 200°C or lower by heating at 140°C for one minute, and exhibits improved adhesive force by heating at 140°C for one minute and then heating at 200°C for one minute on a Si base material coated with SiN and shows an adhesive force of 1.0 MPa or over determined at 180°C. The semiconductor element is produced using the same. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
