| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin particle (composite resin particle) encapsulating inorganic filler (such as a metal oxide). Ž<P>SOLUTION: An inorganic filler (such as a metal oxide particle), a polymer, and an aid such as water-soluble polysaccharides are melt-mixed to prepare a dispersion including a resin particle containing the inorganic filler as a dispersed phase and the aid as a continuous phase, wherein the inorganic filler is certainly encapsulated in the resin particle by selecting a filler treated with a silane coupling agent having a hydrophobic group as the inorganic filler. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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