| 摘要 |
PROBLEM TO BE SOLVED: To provide a wired circuit board which further suppresses a peeling of a cover insulating layer from a conductor wire. SOLUTION: A plurality of conductor wires 2 are formed side by side on an upper face of a base substrate 1, and the conductor wires are covered with a cover insulating layer 3 made of polyimide to form the wired circuit board. Here, when a thickness of the cover insulating layer from an upper face of the conductor wire 2 is t1, a thickness of the cover insulating layer from the upper face of the base substrate at the center of a space between the conductor wires is t2, a thickness of the conductor wire from the upper face of the base substrate is tc, and then a thickness of the cover insulating layer from the side of the conductor wire to a lateral direction at a height of [(t2+tc)/2] from the upper face of the base substrate is t3, the cover insulating layer is formed so as to satisfy t1≥t2 and t1>t3, so that stress following thermal shrinkage of the cover insulating layer is reduced. COPYRIGHT: (C)2010,JPO&INPIT
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