| 发明名称 |
ELECTRONIC DEVICE HOUSING |
| 摘要 |
An electronic device housing includes a metallic base part 101; a resin part 402 fixed to the base part 101; and a printed circuit board 104 coming into contact with the resin part 402; wherein bonding of the base part 101 to the resin part 402 is carried out by way of a nanomold technique and wherein the resin part 402 has insulating property.
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| 申请公布号 |
US2010148044(A1) |
申请公布日期 |
2010.06.17 |
| 申请号 |
US20070295920 |
申请日期 |
2007.03.29 |
| 申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
SATONE TOSHIKAZU;IIJIMA MIKIO;NAKAJIMA HAJIME;OKAMURO TAKASHI;OHMURA YOHICHI |
| 分类号 |
G01B11/26;G01D5/34;H05K7/00;H05K13/00 |
主分类号 |
G01B11/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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