| 摘要 |
Provided is a method of manufacturing a thin film device which includes a thin film body and a substrate supporting the thin film body including forming a thin film body on a first substrate; bonding the thin film body to a second substrate; and transferring the thin film body onto the second substrate by detaching the first substrate from the thin film body. In the method, the thin film body has a plurality of corners in a top view and at least one corner of the plurality of corners is chamfered, and the first substrate is peeled off from a portion where the one corner contacts therewith, in the transferring of the thin film body.
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