| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a liquid jetting head tip which is bonded to a bonding surface without leaving air bubbles, and does not generate a liquid leakage. Ž<P>SOLUTION: The manufacturing method for the liquid jetting head tip includes a release groove forming step, an application step, a pressurizing step, a heating step, and a discharge groove forming step. In this case, in the release groove forming step, a plurality of release grooves which are opened on the end surface of a base plate are formed on the bonding surface of the base plate which is polarized in the board thickness direction. In the application step, an adhesive is applied on the bonding surface of a piezoelectric plate. In the heating step, the base plate on which the release grooves are formed is stacked with the piezoelectric plate on which the adhesive is applied, and they are pressurized in the board thickness direction under the stacked state. In the heating step, the base plate and the piezoelectric plate which are pressurized by the pressurizing step are heated and bonded by heating. In the discharge groove forming step, a plurality of discharge grooves are formed along the release grooves from the surface on the opposite side from the bonding surface of the piezoelectric plate which has been bonded to the base plate. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
