发明名称 METHOD OF MANUFACTURING FILM-CARRIER TAPE FOR MOUNTING ELECTRONIC COMPONENTS, AND METHOD OF DESIGNING PHOTORESIST PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a film-carrier tape for mounting electronic components and a method of designing a photoresist pattern capable of suppressing the generation of difference of inner lead length and generation of a taper shape. SOLUTION: A method of designing a photoresist pattern designs a photoresist pattern 2a for forming an inner lead 6a. In the method, the photoresist pattern 2a has an inner lead pattern obtained by extending a pattern having the same shape as the inner lead 6a in a width direction, and a correction region pattern formed at a head end of the inner lead pattern. A hole 1 is formed in the correction region pattern, and a predetermined distance S is formed between the hole 1 and the head end of the inner lead pattern. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010135460(A) 申请公布日期 2010.06.17
申请号 JP20080308250 申请日期 2008.12.03
申请人 SEIKO EPSON CORP 发明人 SUGAWARA HIROYUKI
分类号 H01L21/60 主分类号 H01L21/60
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