Disclosed is a polyimide film, which is very transparent and very resistant to heat and thus undergoes little dimensional change under thermal stress, and is suitable for use in transparent conductive films, TFT substrates, flexible printed circuit boards and so on.
申请公布号
WO2010036049(A3)
申请公布日期
2010.06.17
申请号
WO2009KR05475
申请日期
2009.09.25
申请人
KOLON INDUSTRIES, INC.;CHO, HAN MOON;PARK, HYO JUN;JEONG, YOUNG HAN
