ACOUSTIC/ELECTRICAL SIGNAL CONVERTING PACKAGE

摘要

The present invention relates to an acoustic/electrical signal converting package. The acoustic/electrical signal converting package of the present invention achieves a significant improvement over the structures of conventional acoustic/electrical signal converting packages. The present invention provides an acoustic/electrical signal converting package forming a trench on a part of a printed circuit board, and an acoustic/electrical signal converting element, a set of signal processing circuits, and the like are buried in the trenches, thereby preventing the upper area of the printed circuit board from being unnecessarily occupied by the acoustic/electrical signal converting element, the set of signal processing circuits, the like. Further, the present invention achieves a simple structure of a linear electrical connection pattern which can replace a loop-type electrical connection wire, thereby enabling flexibility in mutual electrical connection. The present invention may guide the manufacturers to flexibly manufacture optimum products according to the needs of users while effectively overcoming problems caused by the structure in that an acoustic/electrical signal converting element and a set of signal processing circuits are mounted on a printed circuit board, problems caused by use of an adhesive for the adhesion and fixing of an acoustic/electrical signal converting element, and problems caused by a loop-type arrangement of electrical connection wires.