| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To measure the bonding strength only between an input bump electrode and a GND bump electrode in an RFID inlet. <P>SOLUTION: In the RFID inlet, a third pattern 4f of a chip mounting area 4c is separated from a first pattern 4d and a second pattern 4e. Thus, when a bump electrode 2 is connected to a metallic pattern 4 by application of ultrasonic wave in assembling of the RFID inlet, the third pattern 4f moves according to the vibration of the ultrasonic wave since it is not supported by a pattern that serves as a beam. Accordingly, the bonding force between a chip support bump electrode 2c and the third pattern 4f can be reduced, compared with the bonding force between an input bump electrode 2a and the first pattern 4d or the bonding force between a GND bump electrode 2b and the second pattern 4e. In connecting strength inspection of the bump electrode 2, the bonding strength only between the input bump electrode 2a and the GND bump electrode 2b can be measured. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
