| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a film carrier tape for electronic component mounting by which exposure precision is enhanced by forming a mark for exposure position confirmation. SOLUTION: The method of manufacturing the film carrier tape for electronic component mounting includes applying a conductor layer and photoresist onto a base 1. A resist pattern 4b for wiring and a resist pattern 4a for the mark for exposure position confirmation are formed on the conductor layer by exposing and developing the photoresist using a mask for exposure arranged on the photoresist. The formation position of the resist pattern 4a for the mark for exposure position confirmation is confirmed and a wiring pattern 3b is formed through wet etching. Further, the pattern width W of the resist pattern 3a for the mark for exposure position confirmation is less than the thickness of the conductor layer, and when the conductor layer is processed by the wet etching, the conductor layer 3a positioned below the resist pattern 4a for the mark for exposure position confirmation is removed. COPYRIGHT: (C)2010,JPO&INPIT
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