| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for improving the heat radiation performance of a semiconductor package and a heat radiator. SOLUTION: In the semiconductor package 100 having a semiconductor chip 110, a contact surface 112 opposing a heat spreader 200 is formed in a convex portion gradually bent to the heat spreader 200 side from the outer edge of the semiconductor package 100 toward a center portion, and a grease 120 having high heat conductivity is applied to the surface of the contact surface 112. When a force G is applied to the semiconductor chip and the heat spreader so that they can press each other, the both contact through the grease. COPYRIGHT: (C)2010,JPO&INPIT
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