发明名称 |
MEMS DEVICES AND METHODS WITH CONTROLLED DIE BONDING AREAS |
摘要 |
Microelectromechanical system (MEMS) devices and methods with controlled die bonding areas. An example device includes a MEMS die having a glass layer and a protective package. The glass layer includes a side facing the protective package with at least one mesa protruding from a recessed portion of the glass layer. The at least one mesa is attached to the protective package. An example method includes creating at least one mesa on a glass layer of a MEMS die and attaching the at least one mesa to a protective package.
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申请公布号 |
US2010147075(A1) |
申请公布日期 |
2010.06.17 |
申请号 |
US20080333200 |
申请日期 |
2008.12.11 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
MAGENDANZ GALEN;ESKRIDGE MARK;LOESCH MATT |
分类号 |
G01P15/14;B32B37/12;G01P15/00 |
主分类号 |
G01P15/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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