METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS

摘要

A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semi conductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the clea ning process. The gap can be increased or reduced by 0.5? /N for each rotation of the chuck, where ? is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5 ?n during the cleaning process, where ? is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1.