| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating solution by which, the upper face of a via hole and the upper face of a conductor circuit in the same layer can be formed on almost the same plane in producing a multiplayer printed circuit board. SOLUTION: This electroplating solution used for producing a multilayer printed circuit board obtained by laminating a resin insulating layers one after another and a conductor circuit on a substrate provided with a conductor circuit contains copper sulfate of 50 to 300 g/l, sulfuric acid of 30 to 200 g/l, chlorine ions of 25 to 90 mg/l and an additive of 1 to 1,000 mg/l at least composed of a leveling agent and a lustering agent. |
