DEPOSITION AND SUBSTRATE ETCHING APPARATUS AND METHOD USING POWDER

摘要

PURPOSE: A deposition and a substrate etching apparatus and a method using powder are provided to perform deposition and etching of a substrate by enabling a metal power to collide a substrate to the substrate through a high pressure transfer gas. CONSTITUTION: A vacuum pump(20) makes the inside of a chamber(10) vacuum. A filter(80) collects a particle which passes through a deposition and etching process. A substrate support unit(30) supports a substrate. An injection nozzle(40) sprays a predetermined volume of powder on the substrate. The gas inlet(50) receives predetermined gas and a powder supply unit supplies the powder to a gas pipe.