发明名称 |
Device for assembling electronic structural elements |
摘要 |
<p>The device comprises an electronic printed circuit board, an electronic semiconductor element or a varistor (4), positioning elements (1), which arranges the electronic semiconductor element or the varistor parallel to the electronic printed circuit board. One of the positioning elements reconstructs the outer contour of the contact surface of the semiconductor element or the varistor.</p> |
申请公布号 |
EP2197000(A1) |
申请公布日期 |
2010.06.16 |
申请号 |
EP20090178212 |
申请日期 |
2009.12.07 |
申请人 |
AIZO AG |
发明人 |
BECK, WILFRIED;BURK, MICHAEL;KEMMLER, WOLFGANG |
分类号 |
H01C1/014;H01C7/12;H05K1/18 |
主分类号 |
H01C1/014 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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