发明名称 Use of silver an a lead-free solder paset
摘要 <p>A lead-free solder paste suitable for soldering chip parts includes a powder of a twin-peak Sn-based solder alloy containing 0.2 - 1.0 mass % of Ag and a flux. The solder alloy has a first peak of heat absorption in a differential scanning calorimeter curve at the start of melting and a second peak when the major portion of the alloy subsequently melts. <IMAGE></p>
申请公布号 EP1245328(B1) 申请公布日期 2010.06.16
申请号 EP20010400534 申请日期 2001.03.01
申请人 SENJU METAL INDUSTRY CO., LTD. 发明人 KATOH, RIKIYA;MUNEKATA, OSAMU;TOYODA, YOSHITAKA
分类号 B23K35/26;B23K35/02;H05K3/34 主分类号 B23K35/26
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