发明名称 |
Use of silver an a lead-free solder paset |
摘要 |
<p>A lead-free solder paste suitable for soldering chip parts includes a powder of a twin-peak Sn-based solder alloy containing 0.2 - 1.0 mass % of Ag and a flux. The solder alloy has a first peak of heat absorption in a differential scanning calorimeter curve at the start of melting and a second peak when the major portion of the alloy subsequently melts. <IMAGE></p> |
申请公布号 |
EP1245328(B1) |
申请公布日期 |
2010.06.16 |
申请号 |
EP20010400534 |
申请日期 |
2001.03.01 |
申请人 |
SENJU METAL INDUSTRY CO., LTD. |
发明人 |
KATOH, RIKIYA;MUNEKATA, OSAMU;TOYODA, YOSHITAKA |
分类号 |
B23K35/26;B23K35/02;H05K3/34 |
主分类号 |
B23K35/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|