| 摘要 |
A packaged semiconductor device (10) includes an interconnect layer (32) over a first side of a polymer layer (30), a semiconductor device (16, 18) surrounded on at least three sides by the polymer layer and coupled to the interconnect layer, a first conductive element (46, 58) over a second side of the polymer layer, wherein the second side is opposite the first side, and a connector block (20) within the polymer layer. The connector block (20) has at least one electrical path (22, 24, 26) extending from a first surface of the connector block to a second surface of the connector block. The at least one electrical path electrically couples the interconnect layer to the first conductive element. A method of forming the packaged semiconductor device is also described. |
