发明名称 Solid state image pickup manufacturing method
摘要 In a solid state image pickup device, in order to form a bypass region (106) with precisely controlled impurity concentration and width, there is provided a solid state image pickup device comprising a photoelectric conversion unit (102,104,105) composed of a first region (102) of a first conductive type formed on a semiconductor substrate (101) and having a principal surface, a second region (104) of a second conductive type formed in the first region, and a third region (105) of the first conductive type present between the second region (104) and the principal surface, a fourth region (107) of the second conductive type formed in the first region (102), and a charge transfer unit including the first region (102), an insulation layer on the first region and a control electrode (103) provided on the insulation layer, for transferring a signal charge accumulated in the photoelectric conversion unit (102,104,105), to the fourth region (107), wherein the photoelectric conversion unit (102,104,105) and the charge transfer unit are connected through a fifth region (106) of the second conductive type.
申请公布号 EP1993137(A3) 申请公布日期 2010.06.16
申请号 EP20080162529 申请日期 1999.03.18
申请人 CANON KABUSHIKI KAISHA 发明人 KOIZUMI, TORU;UENO, ISAMU;SAKURAI, KATSUHITO;SUGAWA, SHIGETOSHI;KOCHI, TETSUNOBU;HIYAMA, HIROKI
分类号 H01L27/146;H04N1/028;H01L31/0352;H01L31/10;H04N1/19 主分类号 H01L27/146
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