| 摘要 |
#CMT# #/CMT# The method involves producing a radio frequency transponder aerial with terminal connection portions (7b, 8b) in contact with a substrate. Contact sections (5, 6) are placed on the substrate. The sections are connected to the portions by soldering (38) e.g. thermocompression type soldering, by introducing energy between the sections and the portions. The sections provide a surface facing one portion, where the portion is arranged on the substrate or flexible support. The energy of the soldering is directly applied to the sections. A reinforcement material is disposed on a substrate surface. #CMT# : #/CMT# The substrate is fixed to a hybrid aerial wire using a thermofusible or thermoplastic non-conductor wire. The flexible support is made of tissue. An independent claim is also included for device comprising a transponder aerial connected to contact sections. #CMT#USE : #/CMT# Method for producing a radio frequency transponder aerial device i.e. electronic radio frequency insert, that is inserted in an electronic radio frequency communication product e.g. contactless chip card and passport (all claimed) i.e. electronic passport, where the device includes a radio frequency transponder aerial connected to a coated microcircuit e.g. electronic chip or module. Can also be used for a sheet lamination. #CMT#ADVANTAGE : #/CMT# The method allows the radio frequency transponder aerial to be connected to the microcircuit in a simple manner, and inexpensively and rapidly manufactures the electronic radio frequency insert presenting low thickness and/or presenting good carrier communication properties. The method avoids the pollution of a soldering tool. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a schematic view illustrating imprints by a soldering tool and anvil on a radio frequency transponder aerial device. 5, 6 : Contact sections 7b, 8b : Terminal connection portions 11 : Metallic contact surface 26 : Cavity 28 : Coated microcircuit 38 : Soldering. |
