| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which the quality assurance is available, handling is facilitated, and the electrodes of the semiconductor chip can be gang-bonded with a flexible substrate, a method of manufacturing the same, a circuit substrate, and the flexible substrate. <P>SOLUTION: A gap-holding member 16 is provided on the surface of the flexible substrate 12, on which bonding portions 24 for the electrodes 14 of the semiconductor chip 10 are arranged; the semiconductor chip 10 and the flexible substrate 12 are placed so as to make the gap keeping member 16 interposed therebetween, and the bonding portions 24 provided on the flexible substrate 12 and the electrodes 14 of the semiconductor chip 10 are bonded; and a molding material is injected, to provide a stress-absorbing layer 26. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
