Method of manufacturing a plurality of semiconductor devices and carrier substrate

摘要

Individual devices (100) are locally attached to a carrier substrate (10), so that they can be removed therefrom individually. This is achieved through the use of a patterned release layer, particularly a layer that is removable through decomposition into gaseous or vaporized decomposition products. The mechanical connection between the carrier substrate (10) and the individual devices (100) is provided by a bridging portion (43) of an adhesion layer (40).