| 摘要 |
A method for production of a microcircuit card, includes the production of a card with electronic component connector pins for an electronic component within the thickness thereof and provided with a cavity with a base and defined by a slope on which the connector pins are arranged and production of a module including a support film with external contacts on an external face thereof and internal contacts on an internal face thereof. An anisotropic flexible conducting adhesive is then applied to the periphery of the internal face of the film, a resin more rigid than the adhesive is introduced into the cavity of the body, the module is inserted into the cavity such that the anisotropic adhesive is located opposite the periphery of the slope of the cavity, the anisotropic adhesive is thermally activated under pressure and the resin polymerized.
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