| 摘要 |
PURPOSE: A stacked chip package including a through wafer via is provided to stably supply a power source by transmitting signals to through wafer via or wire bond after dividing the signals according to frequencies. CONSTITUTION: A stacked chip package(700) includes a semiconductor substrate(780), a plurality of semiconductor chips(710,720,730,740), a plurality of first through wafer vias(713), and a plurality of second through wafer vias(711a,711b,712a,712b). The semiconductor chips are laminated on the semiconductor substrate. The first through wafer vias are formed on a first same coordinate of the semiconductor chips, penetrate the semiconductor chips, and transmit a high frequency signal. The second through wafer vias are formed on a second same coordinate different from the first same coordinate, penetrate the semiconductor chips, and transmit a low frequency signal. |
