| 摘要 |
PURPOSE: A compression mode molding device is provided to enhance the yield of a light emitting diode molding process by regulating the degree, speed, and time of the pressure pressurizing molding material. CONSTITUTION: An upper mold(160) elevates a first drive unit(138). A lower mold(170) comprises a cavity base block and a cavity boundary block. The cavity base block forms the bottom side of a cavity. The cavity boundary block is integrated with the upper mold, and forms a cavity. A second drive unit comprises a shift block which compresses the molding target and a resin in the cavity. The base block supports the lower mold.
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