发明名称 |
Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode |
摘要 |
A collective substrate has through-holes. The through-holes each have an interior surface including taper surfaces which are tapered as having an opening size progressively decreasing from a main surface and an external connection surface toward a minimum size hole portion. A semiconductor element mount includes an insulative member cut out of the collective substrate. An imaging device includes an imaging element mounted in a region surrounded by a frame which is bonded to the main surface of the insulative member and closed by a cover. A light emitting diode component includes a light emitting element mounted on the main surface of the insulative member with the minimum size hole portion of the through-hole being filled with an electrically conductive material, the light emitting element being sealed with a fluorescent material and/or a protective resin.
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申请公布号 |
US7737562(B2) |
申请公布日期 |
2010.06.15 |
申请号 |
US20070987170 |
申请日期 |
2007.11.28 |
申请人 |
A. L. M. T. CORP. |
发明人 |
HIGAKI KENJIRO;TAKAGI DAISUKE;ISHIDU SADAMU;TSUZUKI YASUSHI |
分类号 |
H01L23/48;H01L23/52;H01L29/40;H01L33/50;H01L33/56;H01L33/58;H01L33/62 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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