| 摘要 |
An optical pickup device having an optical module provided with an optical element and bonded and fixed to an optical pickup case, wherein the optical module is fixed to the optical pickup case by a first ultraviolet curing adhesive at at least two positions with an optical axis between the positions, the optical axis extending from the optical element to the optical pickup case, and at least a part of an exposed surface of the first ultraviolet curing adhesive is covered with a second ultraviolet curing adhesive higher in hardness or elastic modulus than the first ultraviolet curing adhesive to diminish an optical axis offset of the optical pickup device, further, a heat dissipating material higher in thermal conductivity than the first and second ultraviolet curing adhesives is brought into contact with both optical module and optical pickup case to improve the heat dissipating performance of the optical pickup device.
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