发明名称 Low resistance void-free contacts
摘要 A plug is formed by depositing a first material to partially fill an opening, leaving an unfilled portion with a lower aspect ratio than the original opening. A second material is then deposited to fill the remaining portion of the opening. The first material has good filling characteristics but has higher resistivity than the second material. The second material has low resistivity to give the plug low resistance.
申请公布号 US7737483(B2) 申请公布日期 2010.06.15
申请号 US20050296235 申请日期 2005.12.06
申请人 SANDISK CORPORATION 发明人 HIGASHITANI MASAAKI
分类号 H01L29/76 主分类号 H01L29/76
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