| 摘要 |
PURPOSE: A semiconductor package is provided to overcome the limit of the number of stacked semiconductor chips stacked by controlling the height of a wire loop. CONSTITUTION: Two or more semiconductor chips are stacked on a substrate and have a bonding pad. A connection member electrically connects the bonding pad of the semiconductor chip with a bonding finger. A sealing cover(118) seals one side of the substrate including a connection member and a semiconductor chip. The connection member includes a first connection unit, a second connection unit, and a connection unit. The first connection unit(112) is connected to the bonding pad of the semiconductor chip. The second connection unit(108) is connected to the bonding finger of the substrate. The connection unit connects the first connection unit with the second connection unit and the cross section thereof is elliptical. |
