COMBINED APPARATUS OF VISION INSPECTION AND SORTING FOR SEMICONDUCTOR DIE

摘要

PURPOSE: A semiconductor die inspection and a classification combined device are provided to shorten an inspection time due to inspecting an upper surface and a lower surface simultaneously. CONSTITUTION: A wafer seating unit(110) leaves the wafer movable in every direction. A rotary plate(120) includes a plurality of safe seating recesses with positioning a die. A first pick up unit(130) picks up the die arranged on the wafer and locates on the rotary plate. A second pickup unit(150) picks up the die recorded by an inspection camera and locates on a good product tray or an inferior product tray.