发明名称 PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
摘要 PURPOSE: A printed circuit board and a manufacturing method thereof are provided to electrically easily connect an electrode terminal and the other circuit wiring by forming the electrode terminal including a penetration pattern in order to pass through a board body. CONSTITUTION: A board body(102) forms the body of a whole printed circuit board(100). A first conductive pattern(120) is arranged on an upper side of the board body. A second conductive pattern(122) is arranged on a lower side facing with the upper side of the board body including the first conductive pattern. An electrode terminal(124) is arranged on one side ends of the first conductive pattern arranged on the upper side of the board body or beneath. The electrode terminal has a penetration pattern formed into a blind via(108) capable of passing through the board body in order to connect with the second conductive pattern. A plating layer(116) is arranged on the upper surface of the electrode terminal composed of the penetration pattern in order to improve an electrical characteristic of the electrode terminal.
申请公布号 KR20100064147(A) 申请公布日期 2010.06.14
申请号 KR20080122579 申请日期 2008.12.04
申请人 HYNIX SEMICONDUCTOR INC. 发明人 LEE, KI YONG
分类号 H05K3/42 主分类号 H05K3/42
代理机构 代理人
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