发明名称 IMAGE SENSOR AND METHOD FOR MANUFACTURING THEREOF
摘要 PURPOSE: An image sensor and a manufacturing method thereof are provided to improve a transfer efficiency of a photo charge with connecting a wiring of a readout circuit and an image sensing unit by a metal pattern. CONSTITUTION: A semiconductor substrate(100) including a read out circuit is prepared. A wiring and an inter-insulating layer(160) are formed on the semiconductor substrate. A lower electrode layer(240) is formed on the inter-insulating layer. An image sensing unit(200) is formed on the lower electrode layer. A first via-hole(270) exposes the lower electrode layer. A barrier pattern(285) is formed on the sidewall of the first via-hole. A second via-hole(290) exposes the third wiring.
申请公布号 KR20100063269(A) 申请公布日期 2010.06.11
申请号 KR20080121718 申请日期 2008.12.03
申请人 DONGBU HITEK CO., LTD. 发明人 KIM, TAE GYU
分类号 H01L27/146 主分类号 H01L27/146
代理机构 代理人
主权项
地址